Wafer Edge Viewer "SIM-2300EG"
Equipped with recording function! Supports various wafers such as bonding, background grinding, and trimming.
The "SIM-2300EG" is a wafer edge viewer equipped with recording functionality. In today's processes where wafer thinness is required, it allows for monitoring of the wafer edge conditions, such as "chipping" and "cracking" during back grinding, as well as "foreign material adhesion" and "misalignment" during bonding. It features a high-precision mechanical wafer size changer and alignment function, enabling continuous recording of the top and bottom surfaces and sides of the edge, as well as dimension measurement and binary display. 【Features】 ■ Supports wafer sizes from 4 inches to 12 inches ■ Equipped with a high-precision mechanical wafer size changer and alignment function ■ Compatible with various wafers including bonding, back grinding, and trimming ■ Enables continuous recording of the top and bottom surfaces and sides of the edge, as well as dimension measurement and binary display *For more details, please refer to the PDF document or feel free to contact us.
- Company：三明
- Price：Other
